Plasma Etching Chamber for PCB Manufacturing
A plasma etching chamber that generates low-pressure plasma using dielectric loss to precisely remove material layers from printed circuit boards during fabrication. It is designed solely for semiconductor and PCB manufacturing and is classified under 8514.32.00.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the chamber is used primarily for semiconductor wafer processing
Machines for manufacturing semiconductors or flat panel displays may fall under this heading, which takes precedence for such equipment.
If the chamber performs a non-heating plasma function, such as deposition
Other electrical machines with individual functions may be classified here if the plasma process is not heat treatment.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document that the chamber's operation relies on dielectric loss heating to generate plasma, which is key for classification under 8514.32.00
• Be prepared to explain to the CBSA why it is not classified as semiconductor equipment under heading 84.86
• Ensure compliance with any electrical safety standards for industrial plasma equipment
Related Products under Tariff item 8514.32.00
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ALP Vacuum Arc Consumable Electrode Furnace CE-VAR 300
> An industrial consumable electrode vacuum arc remelting furnace that produces 300mm diameter superalloy ingots for turbine blades. It uses a vacuum arc to melt and refine the alloy, ensuring high metallurgical quality. This furnace is classified under 8514.32.00 as a vacuum arc furnace for industrial heat treatment.
Centorr Vacuum Industries Arc Melt Series 2000
> An advanced research vacuum arc melting furnace equipped with optical emission spectroscopy for real-time alloy composition analysis. It is used in laboratory and industrial settings for melting and refining metals under vacuum. This furnace falls under 8514.32.00 as a vacuum arc furnace for heat treatment.
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> A compact vacuum arc furnace optimized for skull-free melting of reactive titanium alloys, used in aerospace and medical implant manufacturing. It operates under vacuum using an electric arc to melt and refine the alloy without contamination. This furnace is classified under 8514.32.00 as a vacuum arc furnace.
Dielectric Barrier Discharge Plasma Generator for PCB Surface Activation
An atmospheric pressure plasma generator that uses dielectric barrier discharge to activate the surface of printed circuit boards, improving adhesion before lamination. It is designed for use in printed circuit production lines and falls under tariff item 8514.32.00 as an electric furnace for heat treatment.
Dielectric Heating Plasma Cleaner for Circuit Boards
A plasma cleaner that uses dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards before component assembly. It is designed exclusively for the heat treatment step in PCB manufacturing and is classified under 8514.32.00 as a plasma furnace.