Electron Beam Via Filling Furnace for PCBs from Japan
A furnace optimized for electron beam reflow of conductive epoxy in microvia filling during high-density PCB fabrication. It ensures void-free filling, which is critical for HDI interconnect reliability, and operates with precise temperature control.
Duty Rate — Japan → Canada
0%
Import Tips
• Document the electron beam heating mechanism to support classification under 8514.31.00
• Check if the furnace is subject to Canadian electrical safety regulations
• Consider duty relief options if used in a manufacturing process