Electron Beam Via Filling Furnace for PCBs from China
A furnace optimized for electron beam reflow of conductive epoxy in microvia filling during high-density PCB fabrication. It ensures void-free filling critical for HDI interconnect reliability and is classified as an electron beam furnace.
Duty Rate — China → Canada
0%
Import Tips
• Classify the furnace under 8514.31.00 as an electron beam furnace
• Provide CBSA with specifications showing electron beam heating for via filling
• Ensure compliance with Canadian industrial equipment standards