Wafer Lapping Plate from Mexico
A cast iron or composite lapping plate used in semiconductor wafer grinders and lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. This purely mechanical surface finishing part has no electrical features and is not specified or included elsewhere in Chapter 84, qualifying under tariff item 8487.90.00.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Verify the lapping plate is not classified as a tool of heading 68.04 (millstones, grindstones) — if it is a grinding wheel, it may be excluded
• Provide documentation that it is a part of a lapping machine
• Confirm no electrical features are present