Semiconductor Wafer Slicing Saw Blade from Germany
> A diamond-impregnated blade designed for inner-diameter saws that slice ultra-thin wafers from monocrystalline semiconductor boules such as silicon. It is a non-electrical cutting tool that operates as a mechanical part of wafer preparation machinery, without any electrical features. This item is classified under tariff item 8487.90.00 as a machinery part not specified or included elsewhere in Chapter 84.
Duty Rate — Germany → Canada
Import Tips
• > Be aware that if the blade is presented as an interchangeable tool, it may be classified under heading 82.07 rather than 8487—review the product's packaging and invoicing to ensure consistency
• Provide CBSA with the blade's specifications, including diamond grit size and dimensions, to support the classification
• Consider whether the blade is a wear part; if so, it may be subject to different tariff treatment than a machinery part