Double-Sided Wafer Lapper Ring Carrier from Germany
A thin ring carrier that holds multiple semiconductor wafers between upper and lower lapping plates for simultaneous double-sided lapping, ensuring uniform material removal across the wafer batch. This non-electrical process part is not specified or included elsewhere in Chapter 84, falling under tariff item 8487.90.00.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the ring carrier is not classified as a part of a machine of heading 84.64 (machine-tools for working stone, ceramics, etc.) — if it is a tool, it may be excluded
• Document the material (e.g
• stainless steel, ceramic) and its role in the lapping machine
• Confirm no electrical features are present