CMP Polishing Head Retaining Ring from Mexico
A consumable retaining ring for chemical mechanical polishing heads that contains slurry and wafer during planarization, engineered for uniform pressure distribution. This mechanical part of semiconductor wafer polishing machinery contains no electrical features, qualifying for tariff item 8487.90.00 as a machinery part not specified elsewhere.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the retaining ring is not made of plastics or rubber, which could affect classification
• Provide the CBSA with the ring's material composition and function
• Verify whether the ring is a part of a machine of heading 84.86, which could affect classification