Wire Bonding Machine for IC Packaging from China
Automated wire bonding machine that attaches gold or copper wires between semiconductor die pads and lead frame fingers using ultrasonic or thermosonic energy. This equipment is used solely or principally in the assembly of semiconductor devices, which places it under tariff item 8486.40.00 as specified in Note 11 (C) to Chapter 84.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the machine is designed solely or principally for semiconductor device assembly; if it can handle other materials, it may be classified elsewhere
• Have technical documentation ready to demonstrate its principal use to the CBSA officer
• Verify whether the equipment qualifies for duty relief under the Customs Tariff's machinery remissions