Wafer Edge Grinder from United States
> A wafer edge grinder that grinds wafer edges to precise chamfer profiles, preventing chipping during handling and processing. This machine is critical for 300mm and larger wafer handling. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
Duty Rate — United States → Canada
0%
Import Tips
• > Document the edge grinder's specific use in semiconductor wafer manufacturing, including chamfer specifications
• Check if the equipment qualifies for duty-free entry under the Machinery Program
• Provide CBSA with technical literature to support classification under 8486.40.00