Silicon Ingot Grinder from Japan
> A precision grinder for shaping silicon ingots to uniform diameter prior to wafer slicing, with automatic flat generation for orientation. This machine ensures ingots meet exact specifications for downstream processing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as per Note 11(C) to Chapter 84.
Duty Rate — Japan → Canada
0%
Import Tips
• > Ensure the grinder is exclusively for semiconductor ingot processing; provide technical specs for diameter and flat grinding
• Consider duty relief under the Machinery Program for manufacturing equipment
• Prepare a detailed end-use statement for CBSA to confirm classification