Semiconductor Wafer Slicing Saw from Mexico
> A high-precision inner-diameter saw that slices ultra-thin wafers (25-775 microns) from monocrystalline semiconductor boules while minimizing subsurface damage. This machine is critical for producing wafers with minimal defects. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
Duty Rate — Mexico → Canada
0%
Import Tips
• > Provide CBSA with documentation showing the saw is dedicated to semiconductor wafer slicing, including wafer thickness specifications
• Investigate the Machinery Program for potential duty-free importation of production machinery
• Keep technical manuals and intended use records to support classification during customs review