Semiconductor Lid Attacher from Japan
>- Precision equipment that applies and seals metal or ceramic lids onto semiconductor packages using thermal compression or epoxy dispense. It is classified under tariff item 8486.40.00 for the final assembly step in electronic integrated circuit manufacturing.
Duty Rate — Japan → Canada
0%
Import Tips
• >- Provide the CBSA with evidence that the lid attacher is designed exclusively for semiconductor packages, not for general sealing applications
• If the machine uses thermal compression that could be classified under heading 84.62, confirm that the sealing function is principal
• Keep records of the machine's specific tooling for semiconductor lids