Multi-Wire Wafer Slicer from Mexico
> A multi-wire wafer slicer that uses diamond wire to simultaneously cut hundreds of wafers from semiconductor boules, minimizing kerf loss and enabling thin wafer production. This machine is essential for efficient wafer manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, specifically for wafer slicing as per Note 11(C) to Chapter 84.
Duty Rate — Mexico → Canada
0%
Import Tips
• > Confirm the slicer's exclusive use in semiconductor wafer production with technical specifications and end-use statements
• Check eligibility for duty relief under the Machinery Program for manufacturing equipment
• Prepare a clear product description for CBSA to avoid delays in classification