IC Lead Frame Stripper from Japan
>- An automated machine that separates singulated IC packages from continuous lead frames after assembly, featuring vision inspection. It falls under tariff item 8486.40.00 as essential equipment for completing semiconductor device assembly.
Duty Rate — Japan → Canada
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• >- Show that the lead frame stripper is used solely or principally in semiconductor assembly, not for other metal stamping processes, to support classification under 8486.40.00
• If the machine includes vision inspection that could be classified under Chapter 90, emphasize that the stripping function is principal
• Keep documentation of the machine's specific design for IC lead frames