Flip Chip Bonder for Semiconductor Devices from Germany
>- High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. It falls under tariff item 8486.40.00 due to its specialized role in advanced IC packaging processes.
Duty Rate — Germany → Canada
0%
Import Tips
• >- Demonstrate that the flip chip bonder is designed solely for semiconductor packaging, not for general electronic assembly, to support classification under 8486.40.00
• If the machine includes reflow capabilities that could be classified under heading 85.14, confirm that the bonding function is principal
• Provide the CBSA with technical specifications showing the machine's alignment accuracy