Die Bonder Machine for Semiconductor Assembly from Japan
>- A precision machine that picks and places semiconductor dies onto lead frames or substrates using epoxy or eutectic bonding methods. It falls under tariff item 8486.40.00 as it is specifically designed for assembling semiconductor devices.
Duty Rate — Japan → Canada
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• >- Provide the CBSA with documentation showing the die bonder's exclusive use for semiconductor die attachment, not for other electronic components
• If the machine uses epoxy dispensing that could be classified under heading 84.77, emphasize that the bonding function is principal
• Keep records of the machine's bonding accuracy and throughput to demonstrate its semiconductor-specific design