Chemical Mechanical Wafer Polisher from China
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
Duty Rate — China → Canada
Import Tips
• > Ensure the machine is classified under 8486.40.00 by providing technical documentation that proves its sole or principal use in semiconductor wafer manufacturing
• Verify if the equipment qualifies for duty relief under the Customs Tariff's Machinery Program, which may reduce or eliminate duties for certain production machinery
• Prepare a detailed product description and end-use statement for the CBSA to expedite clearance and avoid misclassification