Semiconductor Wafer Lapping Bearing Unit from China
A precision housed bearing for semiconductor wafer lapping and polishing machines, critical for achieving flatness in device fabrication. It is classified under tariff item 8483.20.00 as a bearing housing incorporating ball bearings, specifically for wafer preparation equipment.
Duty Rate — China → Canada
0%
Import Tips
• Document the wafer lapping application to support classification under 8483.20.00
• If the bearing unit is imported with the lapping machine, it may be classified as a part of that machine under heading 8464