Wafer Grinder Spindle Ball Bearing Race from Japan
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention, enhancing performance and longevity in precision grinding applications.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the outer race is not part of a complete bearing
• Provide technical documentation to CBSA to support its specialized use
• Verify compliance with Canadian import regulations for semiconductor equipment parts