Wafer Grinder Spindle Ball Bearing Race from Germany
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention, enhancing performance and longevity in precision grinding applications.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the outer race is not part of a complete bearing
• Provide technical documentation to CBSA to support its specialized use
• Verify compliance with Canadian import regulations for semiconductor equipment parts