Ultra-Precision Wafer Slicing Race from Mexico
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness, delivering precision and consistency in semiconductor manufacturing.
Duty Rate — Mexico → Canada
0%
Import Tips
• Confirm the race is classified as a part of ball bearings
• Provide detailed specifications to CBSA for accurate classification
• Consider potential duty savings under trade agreements if applicable