Ultra-Precision Wafer Slicing Race from China
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness, delivering precision and consistency in semiconductor manufacturing.
Duty Rate — China → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the race is classified as a part of ball bearings
• Provide detailed specifications to CBSA for accurate classification
• Consider potential duty savings under trade agreements if applicable