Wafer Grinder Spindle Bearing from Japan
A wafer grinder spindle bearing is a custom spindle bearing assembly for semiconductor crystal grinders, used to grind boules to wafer diameters with flat indicators. This bearing is designed for high precision and rigidity to maintain flatness and parallelism. It is classified under tariff item 8482.80.00 as an 'other' bearing, as it is a specialized assembly not fitting standard bearing categories.
Duty Rate — Japan → Canada
Import Tips
• Ensure the bearing assembly is described as a spindle bearing for wafer grinders to support classification under 8482.80.00
• Keep records of the bearing's specifications and intended use, as CBSA may verify the specialized nature
• If the bearing is part of a complete grinding machine, it may be classified with the machine under heading 84.86 rather than separately