FAG 7208 B-MP Angular Contact Ball and Cylindrical Roller Bearing from United States
A high-performance combined bearing from FAG that supports both axial and radial forces, specifically designed for wafer lapping and polishing equipment in semiconductor manufacturing. This bearing is critical for maintaining flatness in semiconductor wafers. It is classified under tariff item 8482.80.00 as a combined ball/cylindrical roller bearing.
Duty Rate — United States → Canada
0%
Import Tips
• For semiconductor manufacturing equipment, ensure compliance with any applicable export controls or end-use certificates
• Provide detailed documentation of the bearing's precision grade