FAG 7208 B-MP Angular Contact Ball and Cylindrical Roller Bearing from Japan
A high-performance combined bearing from FAG that supports both axial and radial forces, specifically designed for wafer lapping and polishing equipment in semiconductor manufacturing. This bearing is critical for maintaining flatness in semiconductor wafers. It is classified under tariff item 8482.80.00 as a combined ball/cylindrical roller bearing.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• For semiconductor manufacturing equipment, ensure compliance with any applicable export controls or end-use certificates
• Provide detailed documentation of the bearing's precision grade