Wafer Ring Frame Injection Mold from United States
A specialized mold for producing plastic ring frames that secure semiconductor wafers during dicing and backend processing. It falls under tariff item 8480.71.00 due to its direct role in semiconductor manufacturing equipment preparation.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Classify the mold under 8480.71.00 as an injection-type mold for plastics
• Keep detailed specifications for CBSA inspection
• Verify if the mold qualifies for any duty reduction under trade agreements