QFN Package Encapsulation Mold from United States
A precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. It is classified under tariff item 8480.71.00 as an injection-type mold for plastics, dedicated to semiconductor device molding.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Ensure the mold is described as an injection mold for plastics when importing
• Provide CBSA with technical drawings or manuals to confirm classification
• Consider whether the mold qualifies for duty relief under specific programs