Lead Frame Plastic Encapsulation Mold from Japan
A high-precision mold for injection molding epoxy resin encapsulation on semiconductor lead frames during chip packaging. It falls under tariff item 8480.71.00 as an injection-type mold for plastics, integral to semiconductor manufacturing.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the mold under 8480.71.00 and be ready to demonstrate its injection molding function
• Keep records of the mold's specifications for CBSA verification
• Check for any free trade agreement eligibility that may lower duty rates