BGA Substrate Molding Tool from China
This is a precision injection mold used to encapsulate Ball Grid Array (BGA) semiconductor substrates with protective plastic compounds. It is classified under tariff item 8480.71.00 as an injection-type mold for plastics, specifically designed for advanced semiconductor packaging applications.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the mold is declared as an injection-type mold for plastics under 8480.71.00
• Provide detailed technical specifications to the CBSA to support classification
• Verify if any end-use or temporary import programs apply to reduce duties