Wire Saw Wafer Cutting Mold Frame from United States
A mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. It is made of metal carbide and is classified under this tariff item as a mold for metal or metal carbides.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Ensure the mold frame is used to shape the saw blades, not the frame itself, which would be classified under a different heading
• Provide technical specifications to CBSA to show the mold's function
• Verify the material is metal carbide for correct classification