Wafer Thickness Control Mold from Japan
A mold system for in-process thickness control during semiconductor wafer grinding and lapping operations. It is made of metal carbide and falls under this tariff item as a mold for metal or metal carbides.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the mold is used to shape or control the wafer thickness, not just as a measuring device, which would be classified elsewhere
• Provide documentation showing the mold's role in grinding or lapping
• Verify the material is metal carbide to support classification