Silicon Wafer Polishing Slurry Mold from United States
A mold for polishing pads and slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. It is made of metal carbide and falls under this tariff item as a mold for metal or metal carbides.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Confirm the mold is used to shape the polishing pads or rings, not the pads themselves, which would be classified under a different heading
• Provide documentation showing the mold's role in polishing
• Verify the material is metal carbide to support classification