Edge Grinding Wafer Mold Carrier from United States
A mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. It is made of metal carbide and is classified under this tariff item as a mold for metal or metal carbides.
Duty Rate — United States → Canada
15%
Rate breakdown
26SUR1515%United States Surtax Order (2026) — 15% on US products
Import Tips
• Ensure the carrier is used as a mold in the grinding process, not just as a handling device, which would be classified elsewhere
• Provide technical specifications to CBSA to show the mold function
• Verify the material is metal carbide for correct classification