Wafer Slicing Diamond Wire Guide from China
A precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers, ensuring wire alignment and tension during high-precision slicing. It is a part of the wafer slicing saws of tariff item 8479.89.10.
Duty Rate — China → Canada
0%
Import Tips
• Declare this as a part of the wafer slicing saw (8479.89.10) and provide the machine's model number
• If the guide includes pulleys or rollers, verify whether they are classified under heading 84.83
• Ensure the guide is not considered a general-purpose machine part, which would fall under heading 84.87