Wafer Slicing Diamond Saw
A high-precision inner-diameter saw with a self-contained motor and diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. It uses coolant systems and automated controls. This machine performs a specialized function in semiconductor manufacturing, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is solely or principally used for manufacturing semiconductor devices
Heading 84.86 specifically covers machines for the manufacture of semiconductor devices, which may be more appropriate for wafer slicing saws.
If the saw is a machine-tool for working metal or ceramics
Heading 84.61 covers machine-tools for planing, sawing, or cutting, which may apply if the saw is not exclusively for semiconductors.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide a detailed technical description of the saw's function in semiconductor wafer slicing to support classification
• Verify whether the equipment qualifies for duty relief under the Machinery Remission Program for semiconductor manufacturing
• Ensure the saw's electrical and safety systems meet Canadian standards to avoid customs delays
Related Products under Tariff item 8479.89.90
American-Lincoln Glide 21-Inch Floor Polisher
A 21-inch floor polisher with a 2 HP self-contained electric motor for large venues, offering counter-rotating pads for even polishing on marble and granite. It falls under this tariff item as a mechanical appliance with an individual function not specified elsewhere in Chapter 84.
Automated Optical Media Finishing and Inspection Line
A turnkey finishing line combining edge polishing, center hub insertion, and automated defect inspection for completed optical discs. This line performs a comprehensive manufacturing function for optical media. It is a specialized machine with an individual function, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
Blu-ray Disc Replication Line
A complete production line machine that electroforms metal masters, stamps polycarbonate substrates, applies reflective layers, and bonds discs for Blu-ray manufacturing. This line performs a comprehensive manufacturing function for optical media. It is a specialized machine with an individual function, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
Boule Orientation Grinder
A precision grinder with a motorized X-Y table used to create flats on semiconductor boules at specific angles, indicating crystal orientation, doping type, and resistivity. This machine is essential for aligning wafers during semiconductor processing. It is a specialized machine with an individual function, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
CD-ROM Stamper and Injection Molding Machine
An industrial machine that uses nickel stamper molds to inject polycarbonate and form the base structure of CD-ROMs during optical media production. This machine performs a specialized function in optical disc manufacturing. It is a specialized machine with an individual function, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
Crystal Boule Grinder
A precision grinding machine with a self-contained electric motor that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. This machine prepares boules for subsequent wafer slicing. It is a specialized machine with an individual function, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.