Semiconductor Wafer Lapper from United States
An electromechanical lapping machine with a self-contained motor that uses loose abrasive slurry on cast iron plates to achieve sub-micron flatness on semiconductor wafer surfaces prior to polishing. This machine is critical for bringing wafers to the required thickness and flatness. It performs a specialized function not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
Duty Rate — United States → Canada
0%
Import Tips
• Document the machine's specific function in semiconductor wafer lapping to support classification
• Verify whether the equipment qualifies for duty relief under the Machinery Remission Program for semiconductor manufacturing
• Ensure the lapper's electrical specifications comply with Canadian standards to avoid customs delays