Crystal Diameter Grinder from China
A motorized grinding apparatus that precisely reduces semiconductor boule diameter to standard wafer sizes (150mm, 200mm, 300mm) while maintaining cylindrical geometry. It includes automated measurement feedback for precision. This machine performs a specialized function in semiconductor manufacturing, not specified elsewhere in Chapter 84, so it is classified under 8479.89.90.
Duty Rate — China → Canada
0%
Import Tips
• Clearly state the machine's role in semiconductor boule diameter reduction to support classification
• If the grinder is part of a semiconductor manufacturing line, verify whether it qualifies for tariff relief under the Machinery Program
• Ensure the equipment is properly labelled with its function and specifications for CBSA inspection