Wafer Edge Grinding Machine from United States
A specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. This machine falls under tariff item 8479.82.00 as a grinding machine for semiconductor wafer preparation.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the machine is for edge grinding, not for surface grinding
• Verify that it is designed for semiconductor wafers
• Provide specifications on edge profile precision to CBSA