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8479.82.00/Wafer Edge Grinding Machine/Germany

Wafer Edge Grinding Machine from Germany

A specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. This machine falls under tariff item 8479.82.00 as a grinding machine for semiconductor wafer preparation.

Duty Rate — Germany → Canada

0%
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Import Tips

• Ensure the machine is for edge grinding, not for surface grinding

• Verify that it is designed for semiconductor wafers

• Provide specifications on edge profile precision to CBSA

Wafer Edge Grinding Machine from Germany — Import Duty Rate | Tariff item 8479.82.00