Silicon Ingot Slicing Saw from Japan
A Silicon Ingot Slicing Saw is a high-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. It uses a rotating blade and mechanical feed to cut the ingot, falling under the cutting and grinding functions of tariff item 8479.82.00. This equipment is critical for the initial step in wafer manufacturing.
Duty Rate — Japan → Canada
0%
Import Tips
• Provide the CBSA with detailed specifications to confirm classification under 8479.82.00
• Verify if the saw is used in semiconductor manufacturing, which may require classification under 8486
• Ensure the equipment meets Canadian safety standards for machinery