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8479.82.00/Double-Sided Wafer Lapper/Mexico

Double-Sided Wafer Lapper from Mexico

A simultaneous double-sided lapping machine for semiconductor wafers, achieving uniform thickness across the entire wafer surface. This machine falls under tariff item 8479.82.00 as specialized grinding and lapping equipment for semiconductor processing.

Duty Rate — Mexico → Canada

0%
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Import Tips

• Ensure the lapper is classified as a grinding machine, not as a polishing machine

• Verify that it is designed for semiconductor wafers

• Provide specifications on flatness and thickness control to CBSA

Double-Sided Wafer Lapper from Mexico — Import Duty Rate | Tariff item 8479.82.00