Wafer Lapping Machine from United States
A mechanical apparatus that uses abrasive slurries to lap semiconductor wafers to precise thickness and flatness tolerances before polishing. It removes saw damage and achieves planarity critical for device fabrication, ensuring wafer quality.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the machine is classified as a lapping machine, not as a machine-tool under Chapter 84.60
• Provide CBSA with the machine's specifications showing its lapping mechanism
• Verify if the abrasive slurry is classified separately and requires special handling