Single Wafer Polishing Tool from Japan
An advanced polisher that processes individual semiconductor wafers using chemical-mechanical planarization (CMP) to achieve a mirror-like surface finish. It prepares wafers for photolithography and device formation, ensuring high-quality surfaces.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify as a polishing machine under heading 84.79, not as a chemical apparatus
• Provide CBSA with the machine's mechanical polishing function details
• Check if the polishing pads and slurry are imported separately and require their own classification