Double-Sided Wafer Grinder from Mexico
Equipment that simultaneously grinds both sides of semiconductor wafers using planetary motion and diamond pads for rapid stock removal. It achieves thickness uniformity across 300mm wafers, preparing them for subsequent polishing steps.
Duty Rate — Mexico → Canada
0%
Import Tips
• Ensure the machine is not classified as a machine-tool under heading 84.60 if it works on semiconductor materials
• Provide CBSA with evidence of the machine's specific design for semiconductor wafers
• Consider if the diamond pads are classified separately under Chapter 82