Chemical Mechanical Wafer Polisher from United States
A chemical mechanical planarization (CMP) tool that integrates chemical slurry and mechanical polishing to planarize semiconductor wafers. It removes oxide and metal layers uniformly and includes endpoint detection systems for precise control during device fabrication.
Duty Rate — United States → Canada
0%
Import Tips
• Classify as a machine with a specific function (polishing) under Chapter 84, not as a chemical apparatus
• Keep records of the mechanical polishing function to distinguish from Chapter 38 or 98 items
• Check for any Canadian regulations on chemical slurry handling during import