Wafer Slicing Diamond Saw Blade from United States
This precision diamond-impregnated saw blade is used in wafer slicing saws to cut monocrystalline boules into thin semiconductor wafers. It is classified under tariff item 8475.90.00 as a part of machines for manufacturing or hot working glass or glassware, which includes wafer preparation equipment.
Duty Rate — United States → Canada
0%
Import Tips
• Classify the saw blade as a part of wafer slicing machines under 8475.90.00, not as an interchangeable tool under heading 82.07
• Provide CBSA with the specific wafer slicing saw model it is designed for to support the classification
• If the saw blade is imported with the slicing machine, it may be classified as part of the complete machine rather than as a separate part