Wafer Lapping Machine Polishing Pad from United States
This specialized polyurethane polishing pad is used in wafer lappers and polishers to achieve flatness tolerances required for semiconductor fabrication. It is classified under tariff item 8475.90.00 as a consumable part of machines for manufacturing or hot working glass or glassware, which includes wafer preparation equipment.
Duty Rate — United States → Canada
0%
Import Tips
• Classify the polishing pad as a part of wafer lapping machines under 8475.90.00, not as an abrasive article under Chapter 68
• Provide CBSA with the specific machine model it is designed for to support the classification
• If the pad is made of textile material, verify whether it falls under heading 59.11 instead of 8475.90.00