Wafer Slicing Diamond Saw from Japan
A Wafer Slicing Diamond Saw is a high-precision inner-diameter saw with a diamond blade for slicing thin wafers from silicon boules. It features glass coolant systems and hot-worked enclosures, qualifying it as machinery for hot working glass. This equipment is classified under tariff item 8475.29.00 as other machinery for manufacturing or hot working glass or glassware.
Duty Rate — Japan → Canada
0%
Import Tips
• Describe the glass coolant systems and enclosures in the import declaration to support classification under 8475.29.00
• If the saw is for semiconductor wafers, consider heading 84.86
• Verify that the diamond blade and coolant comply with Canadian safety standards