Wafer Grinder with Auto-Loading from Mexico
A wafer grinder with auto-loading is a fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. It is classified under tariff item 8474.80.00 as semiconductor wafer grinding equipment.
Duty Rate — Mexico → Canada
0%
Import Tips
• Ensure the machine is described as grinding semiconductor wafers, not metal, to avoid reclassification under Chapter 84.60
• Provide the CBSA with the machine's technical documentation showing its automated handling and grinding functions
• Check if the equipment qualifies for duty relief under the Machinery Remission Program