Wafer Grinder with Auto-Loading from Mexico
A wafer grinder with auto-loading is a fully automated back grinder with cassette-to-cassette wafer handling for high-volume 300mm wafer thinning. It is classified under tariff item 8474.80.00 as semiconductor wafer grinding equipment.
Duty Rate — Mexico → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8474800030; Equal To 8474800090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the machine is described as grinding semiconductor wafers, not metal, to avoid reclassification under Chapter 84.60
• Provide the CBSA with the machine's technical documentation showing its automated handling and grinding functions
• Check if the equipment qualifies for duty relief under the Machinery Remission Program