Wafer Edge Profiling Grinder from Mexico
A wafer edge profiling grinder creates rounded wafer edges to prevent chipping during handling and processing. It is classified under tariff item 8474.80.00 as grinding machinery for semiconductor mineral wafers.
Duty Rate — Mexico → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8474800030; Equal To 8474800090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Document that the grinder is for semiconductor wafers, not metal, to support classification under 8474.80.00
• Provide the CBSA with the machine's specifications showing it handles brittle materials
• Consider whether the equipment qualifies for duty-free entry under the Information Technology Agreement (ITA)